Features

• Gold-tin alloys of various compositions are available to suit each application.
• Improved gold-rich layer
• Excellent sealing reliability with fewer defects such as voids
• Sealed devices can be mounted on circuit boards using lead-free solder.

Types

Processed Products

Application

Semiconductor laser modules, optical devices, SAW filters, crystal oscillators, microwave radar components, lead frames, lead pins, ceramic packages, etc.

Gold-tin brazing lids for crystal oscillating devices (Window type)

Application Example – Fusion Products

Features

• The gold rich layer can be improved (bonding and sealing properties) by optimally adjusting gold and tin compositions according to the thickness of gold on the material surface.
• Can be fused not only to ceramics but also to metalized substrates and conductive surfaces.
• High dimensional accuracy with up-to-date equipment
• Shorter assembly process and improved product yields

Changes in the cross-sectional structure of the lid with different Au/Sn compositions

AuSn20

AuSn21.5

Examples of fused products

• Customer supplied materials
  • Conductive surfaces of ceramics
  • Heat sinks and lead frames
  • Semiconductor or compound devices
• Lead pins (Ni/Au plating) … Base materials: Kov, FeNi, Cu, Fe, etc.
• Lids (plates/stamped pieces) … Base materials: ceramic, Kov, FeNi, etc.
• Gold-tin brazing lids for package sealing (left picture)
• Our developed lid for sealing small crystal oscillating devices (Window type) is designed so that gold-tin alloy does not flow into the lid when it is sealed, providing a highly reliable seal with a smaller amount of gold-tin alloy.

Quartz glass lid with AuSn for deep ultraviolet LEDs