September 19, 2025

TANAKA PRECIOUS METAL TECHNOLOGIES will exhibit at PCIM Asia Shanghai 2025, which will be held from September 24 to 26, 2025, at the Shanghai New International Expo Centre (SNIEC). (Booth No.: N4-E52)

At this exhibition, the TANAKA PRECIOUS METAL TECHNOLOGIES will showcase a variety of products for semiconductor packaging, including  bonding wires, Active Brazing Filler Metals, and Silver Adhesive Pastes for Die-bonding.

For more details on PCIM Asia Shanghai 2025, please refer to the following URL.
https://pcimasia-shanghai.cn.messefrankfurt.com/shanghai/en.html