Bonding Technology of AuRoFUSE™ and
Its Future Development
By using AuRoFUSE™, heat dissipation and thermal expansion issues are resolved,
enabling miniaturization and lower costs compared to existing products.
Adoption in various applications is expected including LED Illumination in harsh environments such as
refrigerated warehouses as well as automotive illumination.
Toshinori Ogashiwa,Dr.ENGMetallic Materials Development Department
TANAKA Precious Metals
- TANAKA and S.E.I. Develop High-Power LED Modules Using AuRoFUSE™ Low-Temperature Bonding Material