铜、铜合金键合丝
成本对策的决定版
我们提供无氧铜级的较高纯度的铜(Cu)的更细线（最小15um）。与昂贵的金(Au)线相比有助于降低约90%的成本。
CFB-1 – 较高纯度Cu键合丝
特长
- 线尾接合性优良，参数设置容易
- 稳定的连续接合性
■Continuous Bonding 2nd Pull Test
CFB-1
Conventional
CA-1 – 对应更高可靠性的Cu合金键合丝
特长
- 较高的接合可靠性
- 较宽的接合窗口
- 低电阻
■Bond Reliability
High Temperature Storage Test at 175℃
![[接合可靠性比较图] Bare Cu、CA-1](https://prod-cn-bucket-wpmedia.s3.cn-north-1.amazonaws.com.cn/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_01.jpg)
![[接合可靠性比较图] Bare Cu、CA-1](https://prod-cn-bucket-wpmedia.s3.cn-north-1.amazonaws.com.cn/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_02.jpg)
Bonding Cross Section at 1300 hrs
■2nd Bond Process Window
-
![[第二焊点接合工艺窗口比较]CA-1](https://prod-cn-bucket-wpmedia.s3.cn-north-1.amazonaws.com.cn/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_03.jpg)
CA-1
-
![[第二焊点接合工艺窗口比较] Bare Cu](https://prod-cn-bucket-wpmedia.s3.cn-north-1.amazonaws.com.cn/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_04.jpg)
Bare Cu
技术数据的下载
技术数据可点击以下的图标下载。
