铜、铜合金键合丝
成本对策的决定版
我们提供无氧铜级别的较高纯度的铜（Cu）的更细线（最小15um），还提供通过贵金属镀层具有耐氧化性能的Pd包覆铜线(PCC)。与昂贵的金(Au)线相比有助于降低约90%的成本。
CFB-1 – 较高纯度Cu键合丝
特长
- 线尾接合性优良，参数设置容易
- 稳定的连续接合性
连续接合性第二焊点接合拉力测试
CA-1 – 对应更高可靠性的Cu合金键合丝
特长
- 较高的接合可靠性
- 较宽的接合窗口
- 低电阻
接合可靠性
![[接合可靠性比较图] Bare Cu、CA-1](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_01.jpg)
第二焊点接合工艺窗口
![[第二焊点接合工艺窗口比较] Bare Cu、CA-1](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block02_02.jpg)
CLR-1A – 较高性能Cu键合丝
特长
- 较高且稳定的线尾接合性
- 优良的接合可靠性
- 较宽的接合窗口
![[CLR-1A、Bare Cu、4N Au Wire 特长比较] Wire cost/ Squashed ball rooundness/ 2nd bondability/ Capillary life](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block03_01.jpg)
FAB形状和真圆度
第二焊点接合
![[2nd Pull Strength比较图] CLR-1、Bare Cu](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block03_03.jpg)
![[2nd Bond Parameter Window] CLR-1、Bare Cu](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block03_04.jpg)
可靠性
![[Electrical resistance on uHAST比较图] CLR-1(Halogen)、Bare Cu(Halogen)、CLR-2(Green)、Bare Cu(Green)](https://prod-cn-bucket-wpmedia-oss-upload.oss-cn-shanghai.aliyuncs.com/wp-content/uploads/sites/images/ex/cn/products/images/b08-03/img_block03_05.jpg)
Storage Condition:130。C 85%
Failure ＝ΔR/R0>10%
Wire Diameter : 25μm
BGA Substrate（FR-4）
Mold resin : Conventional type
技术数据的下载
技术数据可点击以下的图标下载。
